Edgeboard Connectors

Results: 2
Manufacturer
Sullins Connector SolutionsTE Connectivity AMP Connectors
Series
-Standard Edge II
Number of Positions/Bay/Row
15-
Number of Positions
3060
Card Thickness
0.054" ~ 0.070" (1.37mm ~ 1.78mm)0.062" (1.57mm)
Pitch
0.100" (2.54mm)0.156" (3.96mm)
Contact Finish Thickness
10.0µin (0.25µm)30.0µin (0.76µm)
Contact Type
-Full Bellows
Color
BlackBlue
Flange Feature
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) DiaTop Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Operating Temperature
-65°C ~ 125°C-55°C ~ 85°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
1-5530841-8
1-5530841-8
CONN EDGE DUAL FMALE 60POS 0.100
TE Connectivity AMP Connectors
181
In Stock
1 : ¥38.26000
Tray
Tray
Active
Non Specified - Dual Edge
Female
-
60
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Phosphor Bronze
Gold
30.0µin (0.76µm)
-
Black
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
-55°C ~ 85°C
EBM15DRXH
EBM15DRXH
CONN EDGE DUAL FMALE 30POS 0.156
Sullins Connector Solutions
442
In Stock
1 : ¥56.40000
Tray
-
Tray
Active
Non Specified - Dual Edge
Female
15
30
0.062" (1.57mm)
2
0.156" (3.96mm)
Dual
-
Through Hole
Solder
Phosphor Bronze
Gold
10.0µin (0.25µm)
Full Bellows
Blue
Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
-65°C ~ 125°C
Showing
of 2

Edgeboard Connectors

Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.