Together, Imagimob and Infineon make it easier and faster to develop and implement AI models in edge devices. See how you can take advantage of this, regardless of your machine learning skill-level, in this short video.

At embedded world 2024, on the DigiKey booth, Kristian McCann speaks with Manuel Hollfelder, Senior Manager Solutions & Application Synergies at Infineon about Infineon lighting shoe.

This week's EYE ON NPI is Infineon’s PSoC™ 4000T Microcontrollers and the CY8CPROTO-040T eval board specifically designed to get you started with the 4000t series MCUs and using the Infineon CapSense technology.

The Infineon Mobile Robot, or IMR for short, is a robotics development platform that demonstrates the latest that Infineon offers for the robotics application.

In this video you will learn all about how TRENCHSTOP™ IGBT7 H7 helps to fulfill the worldwide demand for decarbonization and improved natural resources sustainability, setting an enhanced benchmark for high-speed IGBTs.

This demo will focus on CYW20829 Bluetooth MCU peripheral support for automotive industry standards, such as CAN and LIN, while highlighting its versatility both as an MCU and Bluetooth LE chip.

Infineon’s 20822 module is the ideal turnkey solution delivering a ton of performance and power efficiency in a cost-effective package that contains everything developers will need to integrate Bluetooth into their products.

Listen to our application engineer and his team unveil our Bluetooth LE Long-Range Capabilities and the outcomes of our extensive testing on the CYW20829 device.

The 20822 Bluetooth module is the perfect ready-to-use solution for those looking to streamline Bluetooth development in their products.

Don’t blame the lag, blame your keyboard! HID over GATT vs. HID over ISOC comparison in Tekken 7 with the CYW20829 Bluetooth® MCU.

Introducing the OptiMOS™ 6 200 V family of MOSFETs which utilizes the latest trench MOSFET technology with a revolutionary cell design. OptiMOS™ 6 200 V offers the benefits of exceptionally low on-state resistance and superior switching performance.

Discover this demo board that features Infineon’s 60GHz XENSIV™ radar sensor BGT60UTR11AIP. It consists of a Radar Baseboard MCU7 Plus and a BGT60UTR11AIP sensor shield. The board can be used for product feature evaluations and fast prototyping.

The XENSIV™ BGT60UTR11AIP is a highly integrated 60 GHz radar sensor for consumer electronics and IoT applications. The chip has been optimized for low power and system cost optimization. It is suitable for smart presence sensing.

Infineon’s engineers use antenna swapping to create dependable connectivity, improve data rates, increase system efficiency, and save battery life.

In today’s connected world, excellent reception quality and fast stable connections are a must.

Infineon’s LNAs are designed to optimize the sensitivity of mobile cellular systems. This extends the area of the highest data traffic even in the most remote areas, while also enabling maximum network efficiency.

Infineon's AIROC™ CYW5557x is a powerful Wi-Fi 6/6E and Bluetooth® 5.3 SoC family, optimized for IoT connectivity with exceptional power efficiency.

The webinar shows wide-bandgap solutions for Solar and Energy Storage Systems.

Empower USB 2.0 with Infineon's EZ-USB™ serial bridge controllers. Robust and seamless integration. Discover EZ-USB™ portfolio of serial bridge controllers with both fixed and configurable functions and support for several interfaces.

With -94.5 receive sensitivity, 11.5 transmit LE output power providing 106db link budget, and a flexible and easy to use Bluetooth® SDK, the AIROC™ CYW20820 is built for robust connectivity and includes code examples to help you get to market faster