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LED-Slide3

The simple, but very effective package structure is what makes Würth Elektronik LEDs so attractive. The LEDs consist of a low thermal resistance substrate, based on Al2O3 which bring the total thermal resistance of the package to 8K/W – allowing for optimal thermal design and a long lifetime. Würth Elektronik also offers a standard size package of 3.5mm x 3.5mm with the same soldering pad for all models, making the PCB design as simple as possible, as the LED can be interchanged with ease. Further the lead frame design is optimized for high power usage, providing minimum electrical resistance. This is true not only for the conduction but through the usage of gold plating and also for the contact resistance. The gold allows for better oxidation security and enjoying better contact and solderability for a longer time – compared to silver or tin plating. The use of AlInGaP and InGaN chips with 1mm2 size, are able to be driven with currents up to 1A, and endure power dissipation of 3W. The optimal design and excellent thermal properties of the chip, allows the LEDs to work perfectly with junction temperatures – up to 125°C. In addition, the use of the silicone dome lens allows perfect light extraction. It is adapted for each wavelength, and ensures the same height of the package for perfect secondary optic coupling. The standard sizing allows the usage of many already developed optics on the market, without any additional losses or changes.

PTM Published on: 2018-04-13