Thermoelectric assemblies can be found in different ranges of size and thermoelectric heat pumping. In these cases, the cooling capacity and power needs have been engineered into the product to allow for easier application selection and ease of integration. For many systems, air-to-air assemblies are necessary. This is the case for most refrigeration and outdoor electronic enclosures. These assemblies have fans and heat sinks on both sides of the thermoelectric devices to allow for easy heat acceptance and rejection in many environments.