This image shown here illustrates a basic conduction cooled heat-frame assembly as an exploded view. This heat-frame assembly would then mount to a PCB to assist in the cooling and ruggedization. The PCB with heat-frame mounted would be installed within a card slot of an enclosure, typically an ATR or ARINC enclosure, designed for conduction cooling. The wedgelocks will clamp the PCB and heat-frame within the card slot, securing the PCB to resist shock and vibration as well as providing a thermal path from the hot components of the PCB to the temperature controlled walls of the enclosure.