The high power density is a result of the construction that maximizes the heat transfer from the resistance element to the PCB. The key features are: a thin layer of thermal film that electrically separates the resistance element from the terminal and provides for a short efficient thermal path, large copper terminals which provide a large surface area that thermally connects the resistive element to the circuit board, and finally, the low thermal resistance of this series enables high power density and minimizes measurement error caused by TCR effects of self-heating due to applied power or PCR (power coefficient of resistance).