The UMA 0204 and UMB 0207 MELF resistor series offers significant advantages compared to thin film chip resistors. The cylindrical ceramic substrate is covered by an advanced homogeneous metal film resistive layer that enables a low temperature coefficient. Its cylindrical shape results in a larger substrate volume and a larger resistive element area as compared to chip resistors, allowing for a higher power dissipation. A precise helical laser trimming cut applied to the resistive film allows for a tight tolerance and an even distribution of thermal energy across the entire resistive element when the resistor is in use. As a result the MELF resistors stability is enhanced.