Hot spots are inherently present on all DRAM components. The application of the heat spreader removes heat from the DRAM component surface area. The heat spreader is a plate made of anodized, non-corrosive aluminum, which has a high thermal conductivity. By definition, heat is "spread out" over the DRAM components resulting in higher reliability and extending the life of the system. Adding a heat spreader to the memory module can reduce the operating temperature by over 8° - 10° Celsius and reduces the potential occurrence of single-bit errors thereby delivering a robust memory module solution and improved system performance.