To solve this problem with the TMP006, the device is placed directly onto the PCB. The TMP006 then reads the infrared energy that is coming off of the case and gives the exact case temperature. This placement circumvents the assembly challenges presented by the other options. With an accurate reading of true case temperature, both safety and performance can be improved. This placement also can allow the TMP006 to look outside of the main device, enabling a wide variety of new applications.