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CKC-Slide8

In summary, due to high density integration in ICs and limited board space, component count reduction methods are employed. TDK’s CKC series achieves this by offering multiple multilayer ceramic chip capacitors in a single compact package. TDK’s Array Capacitor family is also used for decoupling, bypassing, reducing crosstalk, and lowering costs associated with placement time and storage space. The CKC series also optionally features soft termination for crack mitigation purposes in mobile products and around the connectors in automotive applications. In addition, TDK provides design tool services to support optimal CKC series component selection.

PTM Published on: 2013-09-25
PTM Updated on: 2015-08-27