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Thermally Conductive Gap Filler Rolls Slide 23

TI900 has a thermal conductivity of 1.8 W/m.k and is designed for applications where the lowest possible thermal impedance is needed. The principle applications of this product are to enhance heat-flow from the device to the heat sink and to provide electrical isolation. TI900 can provide both of these functionalities and offers a great design solution.

PTM Published on: 2013-01-10