In summary, T-Global's PCM-20 is a range of phase change materials designed to fill air gaps and voids between the heat generator and heat sinks, while at the same time displacing entrapped air between power dissipating components. The performance of the heat sink benefits a lot from the low heat resistance while improving the microprocessor performance, the DC-DC converter of the memory module, and the reliability of the power module. A phase change material is applied as a solid pad and melts (or phase changes) when the electronic device is first powered up to give a thin bond line of thermal interface. This results in excellent heat transfer, a very low thermal impedance, and extreme performance.