One of the most critical conditions effecting the operation of DRAM modules is high die temperature, because it leads to loss of cell information. With die sizes continually shrinking, the power dissipation is concentrated on only a few square millimeters, which creates a greater concentration of heat. Adding a heat spreader to a module allows the hot spots to easily dissipate the temperature over a bigger surface. This heat spreader balances out the module heat dissipation, thus reducing hot spot temperatures and improving the module reliability. Swissbit offers heat spreader solutions on many of its industrial temperature grade SODIMMs and MiniDIMMs.