While this module focuses on micro pitch board-to-board interconnects with pitches of 0.100” and 2 mm, other popular Samtec board-to-board interconnect systems include: high speed, controlled impedance systems to optimize signal integrity; micro pitch systems on 0.4 mm, 0.5 mm, 0.635 mm, 0.8 mm, and 1 mm pitch; rugged and power systems for industrial, high reliability, and high shock, vibration applications; micro edge card systems; micro backplane systems; and one piece interfaces for reliable, high shock and vibration applications.