Another crack solution is called soft termination. Shown here, an epoxy layer is added to the terminal electrode. The epoxy absorbs and redirects mechanical stress away from the ceramic body thus preventing the signature bending crack. Since the epoxy has a greater ability to absorb the stress, the results is a much higher bending strength without failure to the capacitor. The example plot shows a traditional MLCC (Cu termination) failing just after 2 mm bending. The soft termination remains intact as the PCB continues to bend. In this example testing stopped at 10 mm but the soft termination still had no failures.