The DIP-10, or “M”, package is the newest addition to Power Integrations packaging portfolio. The “M” package allows extra pins for heat sinking and more functions than the DIP-8 package. The additional functions include: external current limit adjustment; remote ON/OFF function; OV, UV, line feed forward with DCMAX reduction; output over voltage protection (OVP); and device reset. Also, the source pins are all located on one side for simplified heat sinking.