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Image of Phoenix Contact Industrial Case System (ICS) - Microelectronics and Heat Dissipation

Many OEMs turn to the growing use of System-On or Computer-On Modules - SOM or COM, for short. These modules allow an engineer to incorporate dedicated functionality directly into their product concept with very little design work and time. With many reputable chip manufacturers supplying these dedicated modules at affordable prices, the R&D savings are hard to pass up. The use of these powerful modules comes with a challenge: to ensure that the electronics stay sufficiently cooled to work properly for the anticipated lifetime of the finished device. With great processing power, heat is generated and must escape the packaging of the device.

PTM Published on: 2021-01-22