There are five Selection Criteria for Thermal Gap pads. First, Pressure refers to the available pressure in the application to compress the Thermal Gap pad. Pad thickness definitely matters when selecting solutions based on this criterion. Secondly, Gap Range is the size of the customer’s available air gap to fill in their application and Gasket Compression Range is the recommended percent compression limits of each Gap Pad material. These are paired together to be sure that the Gap Pad fills the application’s air gap range and also it properly deflects the Gap Pad without putting too much stress on the electronics. With the mechanical issues above now addressed, Thermal Conductivity (k) is going to be the next key selection property for the customer’s application, with higher values generally desired by most customers. Fourth, is the decision of a Layer Material option. The vast majority of the Thermal Gap Pad solutions have a Layer Material, that provides an attachment option, clean break feature or addresses gaskets in shear. Lastly, briefly talked about are Commercial Concerns, as some products are more expensive due to filler type.