The 3038 is mounted using reflow soldering techniques. For uniform heating, ovens that utilize a full combination of convection and IR heating should be used. The device should also go through a gradual preheating, a short time at high temperature and controlled cooling. Finally, the board should be removed from the heat source in a smooth motion to ensure the sensor is not jarred while the solder is soft. A wash with de-ionized water after the soldering process will remove most residue from the board.