With each successive generation of FPGAs and ASICs requiring more current, power dissipation within the DC/DC converter is becoming significant even when operating efficiency exceeds 90%. The challenge is how to efficiently remove the heat inside the converter when the PCB is thermally saturated. Linear Technology engineers created a heatsink at the top of the package which has a low thermal resistance to the two biggest sources of heat within the module, the power MOSFETs and inductors. A flat surface is maintained at the top of the LGA package to support the option of an external heat sink.