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KOCAP-Slide10

The power capability for these capacitors is dependent on the ESR and the physical structure of the package to conduct heat from the pellet structure. A facedown package (thermal resistivity of 44°C/W for the T528, and 160°C/W for the T520) can stay cooler with more power passing through it. To achieve +20°C temperature rise at 1MHz, the T520 would be restricted to 4.74Arms (125mW), while the T528 will allow 8.73Arms (450mW).

PTM Published on: 2011-10-24