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Prevention of Stress on the Solder Joint

The final product feature addresses a big concern of customers, and that is the stress on the solder joints. There are certain situations when multiple connectors are mounted on the same pair of PCBs where this comes into play. However, IRISO’s Z-Move™ technology has ±0.7 mm to accommodate any misalignment. The two mated PCBs will be fixed together by chassis or standoff/screws, which create “residual stress.” The floating feature protects the solder joints and the connector itself from residual stress.

PTM Published on: 2023-01-26