This slide lists the key cautions for successful FSR usage, the “Do Nots”. Do not kink or crease the tail of the FSR device if you are bending it; this can cause breaks in the printed silver traces. The smallest suggested bend radius for the tails of evaluation parts is about 0.1” (2.5mm). In custom sensor designs, tails have been made that bend over radii of 0.03” (0.8mm). Also, be careful if bending the tail near the active area. This can cause stress on the active area and may result in pre-loading and false readings. Likewise, do not block the vent. FSR devices typically have an air vent that runs from the open active area down the length of the tail and out to the atmosphere. This vent assures pressure equilibrium with the environment, as well as allowing even loading and unloading of the device. Blocking this vent can cause FSRs to respond to any actuation in a non-repeatable manner. Also note that if the device is to be used in a pressure chamber, the vented end will need to be kept vented to the outside of the chamber, allowing for the measurement of the differential pressure. Next, do not solder directly to the exposed silver traces. With flexible substrates, the solder joint will not hold and the substrate can easily melt and distort during the soldering. Use Interlink Electronics standard connection techniques, such as solderable tabs, housed female contacts, Z-axis conductive tapes, or ZIF (zero insertion force) style connectors. Do not use cyanoacrylate adhesives (e.g. Krazy Glue) and solder flux removing agents. These degrade the substrate and can lead to cracking. Do not apply excessive shear force. This can cause delamination of the layers. Finally, do not exceed 1mA of current per square centimeter of applied force (actuator area). This can irreversibly damage the device.