This sensor’s compact package size (as small as 7mm x 7mm) is smaller than most competitive board mount pressure sensors, allowing for easy placement on crowded printed circuit boards or in small devices. Additionally, the NBP Series features a durable design that operates over the full temperature range of -40°C to 150°C. The sensor is also available in two media compatibility options: non-gel or gel coatings. The non-gel coating has an input port that is limited to non-corrosive, non-ionic media and should not be exposed to condensation. Gases the non-gel coating can accept are limited to media compatible with high temperature polyamide, silicone, alumina ceramic, silicon, gold, and glass. The gel coating option uses the same materials in the wetted media path but is protected from condensation by a silicone-based gel coating, allowing for use in applications where condensation can occur. Finally, this device features a robust design with reflow mounting J-STD-020D, MSL 1. Rapid stabilization after reflow soldering allows for calibration immediately after soldering.