Hirose’s DF57 Series is an ultra-low profile wire-to-board connector system suitable for applications requiring up to 2.5 amperes per line. Key features include: 1.2mm contact pitch and a height of just 1.4mm when mated. The DF57 series is also designed for space saving on the PCB. The unique “Swing-lock” mating feature assures a more secure connection. The operating current is up to 2.5 amperes when using #28 gauge wire. The contacts of the PCB mount header are designed to prevent solder wicking in to the contact mating area.  Contact retention strength is designed to prevent accidental pull-out of the wire and contact when under load. All materials conform to RoHS.