This slide highlights how Cypress is an integrated company for BLE modules. Cypress’s module competition does not have in-house silicon or software. The silicon competitors do not have their own modules. Cypress has a silicon design, wafer fab, CSP, and QFN packaging. Modules use CSP packing. The software tools will also work with silicon and modules, as well as module hardware design and mass manufacturing. Cypress has developed end-to-end expertise to ensure supply and support, both of which are available to the customers. Also, Cypress modules meet Cypress liability and industry standards quality criteria. Cypress can also supply modules long term because silicon liabilities are not on external companies.