Same Sky's board level and BGA heat sinks are compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages as well as ball grid array (BGA) package types and come in a variety of standard shapes and sizes. Ideal for improving the heat dissipation of both low and high power designs, Same Sky's aluminum and copper heat sinks are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems.