The MLP/MLS flatpack box shape lends itself to electronics packaging. The high capacitance density and its 12.5mm pitch are especially suitable for stacking and power holdup modules. Its broad flat top and bottom make heatsinking simple and effective. The resulting cool operation combined with its nearly hermetic seal and high-purity materials deliver 50 and 100 year lifetimes. Additionally, it works great at cold temperatures of –40°C and less.