The TBU^® device is typically placed in series between the port and IC. As the Bourns^® TBU HSP has no connection to ground, the only capacitance added to the signal line is the parasitic capacitance from the device mounting pads to ground. This capacitance can be minimized by eliminating ground plane below the device on the printed circuit board. This minimizes the effect that the TBU HSP will have on the bandwidth of the protected circuit. Here designers can see the low insertion loss of the Model TBU-CA085-300-WH device in a 50 Ω LVDS test circuit application up to 3GHz.