While Apex offers power amplifiers and precision voltage references, we will look at the power amplifiers first. These come in different flavors, ranging from hybrid designs to power ICs that are based on monolithic solutions. Hybrid devices are small circuits that are mounted within a single package. From the outside there is no distinction between a hybrid device and a monolithic device, except that that package might be larger. Package options include hermetically sealed metal packages or plastic SIP packages. Power ICs are monolithic circuits that are mounted in plastic packages. Open Frames are small circuits that are surface mounted on an insulated aluminum frame. Hybrid packages are typically the most robust packages available. They are also the most complicated and most costly devices, as the limited space demands the use of bare die assembly techniques and special production technologies. Open frames provide the best flexibility and the shortest development time. They offer high functionality as do the hybrid packages but operate within industrial temp ranges. Power ICs are what is most commonly used in the semiconductor industry. However, there are limits in terms on functionality and device parameters.