Apacer adds three technologies to the XR-DIMM which include conformal coating, underfill, and wide temperature. Conformal coating improves product reliability when applied on the surface of printed circuit boards. This protective film can safeguard devices from dust ingression and liquid immersion. Underfill technique is used under the BGA to strengthen solder joints and reinforce the product’s resistance against vibration and thermal shock. This XR-DIMM is designed with wide temperature support to ensure operation reliability in extreme temperatures ranging from -40ºC to +85ºC.