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The LTC3376 fits into a wide variety of application spaces. In automotive, industrial, and communications the key benefits are flexibility and configurability, a highly integrated solution that saves PCB space, high-efficiency, great thermal performance, and low heat generation. In distributed point-of-load DC power systems, the key benefits are flexibility and configurability, a compact solution that saves board space, the flip-chip BGA package and high buck efficiency which gives better thermal management and lower heat generation, plus low output voltages at high currents that are compatible with system rails.
PTM Published on: 2019-10-01
