The LTC3376 fits into a wide variety of application spaces. In automotive, industrial, and communications the key benefits are flexibility and configurability, a highly integrated solution that saves PCB space, high-efficiency, great thermal performance, and low heat generation. In distributed point-of-load DC power systems, the key benefits are flexibility and configurability, a compact solution that saves board space, the flip-chip BGA package and high buck efficiency which gives better thermal management and lower heat generation, plus low output voltages at high currents that are compatible with system rails.