As connectors continue to be developed with smaller pitches and lower profiles, issues regarding board processing become more prevalent. Lower profile connectors have a much higher risk of solder wicking beyond the tails and up into the mating interface. This creates short circuits and, in some cases, renders the connector mechanically unusable. In order to address this concern, FCI employs a proprietary process which places a barrier of nickel between the solder tails and the interior of the connector. This barrier prevents solder from wicking and depositing where it can create quality problems and the need for rework.