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High Speed Interconnects Slide 4

With Amphenol’s design creativity and cost effectiveness, investing in next generation technology for customers is a necessity. Amphenol’s next generation High Speed products will include reducing ten wafer design stacked connectors to four wafers, improving signal integrity, impedance control and improving airflow through the connector. The next generation technology will expand to interfaces such as SFP+, QSFP+, Mini-SAS HD and CXP.

PTM Published on: 2016-06-08