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Packaging and Pinout

The small form factor SOT23 package provides the most compact solution for output current up to 1.2 A. The thermally-enhanced DFN3x3 package can push the output current up to 1.8 A without thermal limitation. For much higher output current up to 4 A, the exposed pad SO8 package will have the best thermal performance to deliver higher output power.

PTM Published on: 2020-12-15