In most of Allegro’s surface mount integrated current sensors rated for < 50 A, Allegro uses an innovative flip-chip approach. By flipping the IC over inside the package, the Hall element on the IC is located close to the current conductor but is still separated by a layer of plastic. This provides galvanic isolation since there is no direct electrical connection between the die and the primary conductor. The ACS726 utilizes this flip-chip assembly process and Allegro’s proprietary high frequency chopper circuit design and digital temperature compensation circuit technology to achieve optimal noise and accuracy performance over the full operating temperature range of -40°C to +150°C.