ATS offers a host of heat sink solutions specifically made for the family of MPC products such as MPC7448, MPC755. These heat sinks, with maxiGRIP attachment, accommodate the packaging requirements for the MPC family of products. The attachment technology enables the heat sink to be installed on the component and removed either for testing or onsite rework. The combination of the phase change material for the thermal interface, and patented maxiFLOW and maxiGRIP heat sink and attachment, respectively, will provide high reliability, lower cost of assembly and reduced cost of overall ownership for PCBs and systems that deploy the MPC family of components.