Compare these interconnect systems from 3M. Each is represented by a 20 position vertical boardmount header mated to a wiremount socket. In the 1990s 3M introduced the Mini Scotchflex® Socket/Header System, shown in turquoise and grey. It is based on .100” x .050” grid as a space-saving alternative to full size .100” systems then in widespread use. A decade later 3M began marketing the Pak50 System based on .050” x .050” grid, shown in yellow and pink. Compared to these legacy systems the new 450 Series – on the top row - demonstrably saves space in all directions – side, end and top – freeing up valuable real estate on and above the PCB.