There are two types of applications for Thermal Interface Materials or TIMs. TIM one is located inside the chip package. TIM two is located between the heat sink and heat source. Typically, TIM two is used to transfer heat from the heat source to the heat sink. Chips and LEDs are heat sources. Heat sinks can range from the traditional fin-shaped metal heat sinks to chassis, metal shielding cans, backlight units and housing cases. Currently, 3M only provides TIM two solutions.