Kinetis KL03 20-pin Chip-Scale Package MCU Family

NXP's Kinetis KL03 chip-scale package (CSP) is available in the ultra-small 1.6 mm2 x 2.0 mm2 wafer-level CSP. The Kinetis KL03 CSP reduces board space while integrating even more rich MCU features than previously seen in the market. The Kinetis KL03 CSP consumes 35% less PCB area, yet delivers 60% more GPIO than the nearest competing MCU. As part of Freescale's Kinetis mini-MCU portfolio, the Kinetis KL03 CSP allows designers to dramatically reduce their board size without compromising the performance, feature integration and power consumption of their end products.