Featuring a compact, precise, and efficient design, Epson timing devices enhance digital medical ecosystems by enabling accurate remote monitoring for wearable medical devices.
As a global technology leader, Epson produces compact, accurate timing devices with low noise and low power consumption for data centers, network interface cards, 5G base stations and more.
Epson RX8111CE 和 RX4111CE RTC 模块配备 32.768 kHz 晶体,可节省 PCB 空间,无需设计外部振荡器电路。
Found in CCTV cameras, smart door locks and more, Epson timing devices allow for convenient smart home automation with their remarkably efficient, compact and precise design.
Learn about the newest addition to Epson’s microdevice lineup—the FC2012AN 32 kHz crystal, a low-ESR solution ideal for battery-powered IoT devices, wearables and other low-power applications.
Ideal for applications that require low power consumption over a wide temperature range, Epson’s compact, low ESR 32.768 kHz crystals bring high performance to IoT devices, wearables, wireless modules, medical devices and more.
There’s no time like the present to explore Epson’s latest lineup of real-time clock modules. Designed for precision and versatility, Epson's RTCs operate across a range of temperatures with low current consumption and offer useful features.
Powerful and versatile, the Epson RX8901CE and RX4901CE RTC modules offer low-power, high-accuracy and temperature-stable time resolution, independent of MCU operation. This makes them ideal for a broad range of applications.
Epson 的 FC2012SN 32.768 kHz 晶体单元采用紧凑的 2.05 mm x 1.2 mm 封装,具有 -40°C 至 +105°C 的扩展温度范围。
Epson 的 RX4901CE 和 RX8901CE 最多可支持三个事件引脚和 32 个时间戳,一次能够检测多达三个单独的事件。
Epson 的 FC3215AN 是一款 32.768 kHz 晶体单元,具有 35 kΩ 的低 ESR,采用紧凑型封装,适用于便携式电子设备和空间受限的应用。
Epson 的 FC2012AN 32.768 kHz 晶体单元采用紧凑型封装,非常适合便携式电子产品和空间受限的一些应用。
EPSON 的 SG3225CAN 是一款低功耗、简单封装的晶体振荡器 (SPXO),具有 3.2 mm x 2.5 mm 封装的 CMOS 输出。
Epson TG-3541CE 的 DTCXO 精确时间精度使设备能够更长时间地睡眠,无需经常唤醒,以便延长电池寿命。
Digi-Key Electronics, a global electronic components distributor, was honored with the Epson 2018 Most New Business Opportunities award at the 2019 EDS Leadership Summit in Las Vegas, Nev.