Expanded Serial Peripheral Interface (xSPI) Industrial STT-MRAM Persistent Memory

The EMxxLXB is the industry’s first xSPI serial interface persistent memory based on Everspin’s unique industrial STT MRAM technology.

EMxxLX xSPI Industrial STT-MRAM

The Highest Performing Persistent Memory in the Industry.

Image of MikroElektronika's MIKROE-2914 MRAM Click™ Board MIKROE-2914 MRAM click Board™ 发布日期:2018-03-08

MikroElektronika MIKROE-2914 MRAM Click Board™ 采用 Everspin Technologies 的 MR25H256 256 kilobit 串行 SPI MRAM 存储器模块。

Embedded World Contest 2018

Five Amazon Echo Dots will be given away at Embedded World 2018 to qualified customers

Alternative Format for Trace Codes

EverSpin's alternative format for trace codes.

Replacing the Cypress CY14B104NA-BA/ZS45XI

Replacing the Cypress CY14B104NA-BA/ZS45XI nvSRAM with Everspin’s MR2A16Axxx35 MRAM.

48-Ball BGA Packages

Everspin's 48-ball BGA MRAM packages.

MRAM vs FRAM

Comparing technologies: MRAM vs. FRAM from EverSpin.

TSOP2 MRAM Package Guide

EverSpin's TSOP2 MRAM package guide.

MRAM DFN Package Guide

EverSpin's MRAM DFN package guide.

SOIC MRAM Package Guide

EverSpin's SOIC MRAM package guide.

Two to Tango: MCUs Team Up with FPGAs 发布日期:2014-01-08

A look at combining FPGA technology with embedded processors including monolithic approaches, SoC solutions, tack-ups, and modules.

FRAM Can Lower Power and Increase Performance in MCU-Based Systems 发布日期:2012-09-26

Designers working with microcontrollers (MCUs) have come to rely heavily on flash memory for code storage because IC makers have scaled the manufacturing processes for the nonvolatile memory and are producing quite large flash arrays on MCU ICs.

Image of Everspin Technologies Logo EverSpin Technologies, Inc.

EverSpin Technologies 是全球领先的磁基存储器 (MRAM)、传感器开发商和制造商。

Replacing Cypress CY14B104LA-ZS

Replacing the Cypress CY14B104LA-ZS/BA45xxx nvSRAM with Everspin’s MR2A08AxYS/MA35xxx MRAM.

ASE Qualified Assembly Subcontractor

To increase production capacity and improve flexibility in manufacturing Everspin will qualify nine additional products for assembly in TSOP-44 packages at ASE group.

2mm Exposed Pad DFN Package

EverSpin’s 2mm exposed pad DFN package meets both SOIC-8 and DFN8 PCB layouts.

Toggle and Spin-Torque MRAM

Toggle and spin-torque MRAM status and outlook from EverSpin.

Replacing Cypress CY62168EV30LL-45BVXI

Replacing the Cypress CY62168EV30LL-45BVXI (2Mb x 8) MoBL SRAM with Everspin’s MR4A08BMA35 MRAM.

Replacing Cypress CY14B108LA-xx

Replacing the Cypress CY14B108LA-xx 8Mb nvSRAM with Everspin’s MR4A08Bxxx 16Mb MRAM.