Samtec's Severe Environment Testing (SET) is additional testing of certain Samtec interconnects beyond typical industry standards and specifications to ensure performance and reliability in extreme/harsh environments.

Inside what it's like at our Advanced Interconnect Design center.

Samtec's SEARAY™ open-pin-field arrays are high-speed and high-density solutions offering maximum grounding and routing flexibility in 0.80 mm and 1.27 mm pitches.

Samtec’s Signal Integrity Group offers industry-leading SI/PI support locally and around the globe for free! Samtec’s team of technical experts advocates the ideal interconnect solution for your particular application and performance.

Samtec AcceleRate systems are high-speed, high-density board-to-board and cable assembly interconnects.

Precision RF and mm wave are typically for higher frequencies, usually rated at greater than 30 GHz. Samtec RF cable assemblies and board-level connectors are currently rated up to 110 GHz.

Samtec Flyover QSFP 电缆组件的超高密度设计包括通过压接触点的边带信号，以帮助增加气流。Flyover QSFP 系统通过低损耗、超低偏斜双轴电缆，而不是昂贵的高损耗 PCB，路由关键高速信号，提高了信号完整性和架构灵活性。Samtec 专有的共挤式双轴电缆技术消除了单挤介质双轴电缆的性能限制和不一致性，从而提高了信号完整性、带宽和覆盖范围。FQFSP 电缆组件、LP-FQSFP 光管、QSFPC 外壳、HS-QSFP 散热器都是 Flyover 系列的一部分。

The PICMG COM-HPC specification target high performance computing for industrial applications. This new standard defines modules that typically plug into custom carriers.

Samtec Flyover QSFP Cable Assemblies have an ultra-high-density design that includes sideband signaling via press-fit contacts that help increase airflow.

Samtec 坚固的分立式线缆组件和元件在电缆对板、电缆对电缆和电缆对面板应用中提供了出色的空间节省和设计灵活性。Samtec 的分立式线缆组件和元件提供 1 mm 至 2.54 mm 间距，线规范围为 20 AWG 至 30 AWG。它们有多种主体、触点和端子可供选择，具有坚固的闩锁、高可靠性 Tiger Eye™ 或单独遮蔽的触点系统、极化和键控等功能。还可提供工具，用于将元件组装成完整的电缆组件。包括用于小批量项目的简易手动工具，以及可用于大批量项目的台式和自动压接机的敷贴器。

The Samtec rugged discrete wire cable assemblies and components offer incredible space savings and design flexibility in cable-to-board, cable-to-cable and cable-to-panel applications.

Samtec AcceleRate® HD board-to-board system packs hundreds of I/Os in a compact footprint without sacrificing signal integrity. It is ideal in applications where extreme density and up to 56 Gbps PAM4 performance is required.

mPOWER® is the ultimate micro, high-power interconnect solution with incredible design flexibility for power-only or, power/signal applications by using alongside one of Samtec's high-speed connector systems.

Samtec designs and manufactures our own high-frequency, microwave/millimeter wave cables and connectors. In doing so, we're able to ensure the highest quality products that provide precise, repeatable electrical and mechanical results every time.

Samtec offers a full line of edge card connectivity solutions for industries and applications including datacom, industrial, high-performance computing, and the PCI Express® market, along with a product roadmap to support 56 Gbps speeds and beyond.

High cycle, high speed, high power, and harsh environment solutions that maximize space within a system. This includes IP68 & IP67 Sealed, Flexible Power, Rugged Signal Integrity, and Rugged Contact System designs.

From standard products to unique high-performance designs, Samtec’s offering is designed to support any interconnectivity need, regardless of application, performance requirements or environment.

XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit samtec.com/XCedeHD for more information.

This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit samtec.com/ExaMax for more information.

Mitigating damage to components, boards and solder joints in high-normal-force applications, our jack screw standoffs can be applied to 15.24 mm board stack heights.