VideoLibrary

Wakefield Thermal compression pack heat sink and clamp systems provide customers with the complete system solution for proper installation and heat dissipation for high-power compression pack semiconductors.

Wakefield Solutions Fabrication Press

In this video you can see an example of a 110 ton press used to punch wholes in a 3/4 inch base heat sink. This technique allows a cost effective solutions for its customer.

Wakefield Thermal’s 900 Series Heat Sinks for BGA Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.

After the aluminum billet is heated it is then pushed through a die in which shape of the extrusion is intended for.

Since its days as National Northeast, Wakefield Solutions has been one of the leading aluminum extruders and secondary machining since 1953! With two extrusions presses and over 110 Machining Centers!

In this video Wakefield Solutions shows one of its Hundred CNC Machining Centers, Featured in this clip is a Horizontal Hass EC400. Wakefield is capable of not only extruding its own Aluminum but also machining it under one roof!

Bonded Fin Heat Sinks: Wakefield Thermal

Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate.

Overview: Industry trends continue to produce smaller footprints with higher power densities. In some cases, Liquid Cooling is the answer for cooling your application.

Heat Pipe Overview: Wakefield Thermal

Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.

Wakefield Thermal Minute: Front Panels

Wakefield Thermal manufactures custom front panels that are silk-screened, fully assembled, and ready to mount to your Printed Circut Board. Front Panels are made from aluminum extrusions and are manufactured on high-speed CNC machines.

Wedgelock card retainers offer the highest locking force available for cold wall applications. In a typical application they will mount either directly to the PCB or to a heat frame assembly with screws or rivets.

New ways of cooling hot electronics

In this brief video, Mark Pelillo describes heat custom and off-the-shelf heat management products in the areas of liquid cold plates and heat pipe-based phase change.

Wakefield Thermal's Raleigh, North Carolina facility has extensive experience manufacturing milled aluminum heat frames. Heat Frames are used to meet or exceed rugged specification requirements.

Wakefield Thermal manufactures both custom and standard electronic packaging solutions. In June of 2015, Wakefield Thermal announced an exclusive strategic partnership with Heitec AG, a recognized leader in electronic packaging systems (EPS).