We take a look at the PSoC™ 4000T CAPSENSE™ prototyping kit from Infineon. This prototyping kit demonstrates the low power and high performance operation of fifth-gen CAPSENSE technology.
We take a look at the AIROC™ CYW20829 Bluetooth® Low Energy MCU Evaluation Kit from Infineon Technologies for evaluating, prototyping, and developing Bluetooth® Low Energy applications.
Infineon's TLE4973 is a high-precision miniature coreless magnetic sensor suitable for AC and DC measurement.
Duration: 5 minutesInfineon's TRAVEO™ T2G Arm® Cortex®-M4/M7 microcontrollers deliver high performance, enhanced HMI, high security, and advanced networking protocols.
Duration: 5 minutesInfineon's EZ-USBTM HX3 is a hub controller with USB 3.2 5 Gbps connectivity, battery charging, and data transfer for up to four ports downstream devices.
Duration: 5 minutesThis presentation will introduce the Infineon MOTIX™ 6ED2742S01Q 160V Gate Driver technology and explain how it is designed for three-phase BLDC motor drive applications.
Duration: 10 minutesThis presentation will introduce Infineon's PSoC™ 6 microcontrollers and their features, including the high-performance dual-core architecture and the built-in hardware-based security.
Duration: 10 minutesInfineon’s 6EDL7141 3-phase smart motor drive gate driver greatly reduces component count and circuit board size due to the many functions integrated into one package.
Duration: 5 minutesThis presentation will provide an overview of Infineon’s HYPERRAM™ devices, where they fit in the expansion memory landscape, their benefits, and the applications that they go into.
Duration: 15 minutesThis presentation will provide an overview of Infineon’s EXCELON™ F-RAM family and show how the memories are purpose-built for mission-critical data-logging.
Duration: 10 minutesThis presentation will help the customer understand the Infineon MERUS multi-level class D technology and its target applications.
Duration: 5 minutesJoin DigiKey and esteemed Panelists from Infineon, University of San Diego, and SparkFun as we discuss what to expect after graduation. We will also explore ways you can keep sharpening your engineering talent stack for the interview, for your first job, your career, and beyond.
The new TRENCHSTOP™ IGBT7 technology provides higher power density, enabling design engineers to develop compact systems with potentially lower total system costs.
How to select the optimal ESD diode based on IC requirements and the importance of considering external ESD protection given the technology trends in ICs.
Duration: 10 minutesTrenchstop™ 5 is the next generation of thin wafer technology for applications switching to less than 10 kHz.
Duration: 10 minutesUsed to generate the voltage needed to turn high voltage MOSFETs or IGBTs on and off and also offers speed of operation and protection features.
Duration: 10 minutesLow voltage discrete power MOSFETs 40 V and below for DC-DC and DC application, Infineon MOSFET selection tool and cross referencing tool.
Duration: 10 minutesReduce noise and the PCB/system size and component count and reduce EMI noise with the IRAM module.
Duration: 5 minutesReview IGBT concepts, features, applications, and IGBT development in addition to tools and services Infineon provides for designers and engineers.
Duration: 10 minutesThe basic concepts of Power Factor Correction and regulatory aspects.
Duration: 20 minutes