PANJIT bridge rectifiers are designed with matte tin plating, lead-free in compliance with EU RoHS 2.0 and halogen-free according to IEC 61249 standard. The lead frame is designed to maximize die pad and IFSM capability of the same packaging size. With solder paste printing instead of dispensing during die-bonding process to improve soldering stability and lower void rate to under 15%, they are manufactured with automated process, using automatic laser die cutting technology as well as pick-and-place automation for die attach to increase accuracy and prevent dies shifts, micro-cracks and chipping. The wafers are produced with SIPOS/PG/LTO technology to optimize HTRB capability.