MaxiGrip Flip Chip

maxiGRIP™ Flip-Chip

Advanced Thermal Solutions Inc

This tutorial will provide an overview of ATS’s maxiGRIP Flip-Chip including a component view, a TIM (thermal interface material) comparison, and a list of what makes the maxiGRIP unique.

Related Parts

图片制造商零件编号描述连接方法形状可供货数量价格查看详情
HEAT SINK 25.4MM X 25.4MM X 4MMATS-56002-C3-R0HEAT SINK 25.4MM X 25.4MM X 4MM散热带，粘合剂（含）方形，有角度的散热片0 - 立即发货$89.30查看详情
HEAT SINK 23MM X 23MM X 14.5MMATS-53230K-C1-R0HEAT SINK 23MM X 23MM X 14.5MM夹，热介面材料方形，鳍片1171 - 立即发货$83.76查看详情
HEAT SINK 15MM X 15MM X 9MMATS-56003-C4-R0HEAT SINK 15MM X 15MM X 9MM散热带，粘合剂（不含）方形，有角度的散热片366 - 立即发货$97.93查看详情
HEAT SINK 31MM X 31MM X 9.5MMATS-53310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM夹，热介面材料方形，鳍片87 - 立即发货$102.24查看详情
HEAT SINK 23MM X 23MM X 9.5MMATS-53230D-C1-R0HEAT SINK 23MM X 23MM X 9.5MM夹，热介面材料方形，鳍片726 - 立即发货$94.75查看详情
HEAT SINK 25MM X 25MM X 9.5MMATS-53250D-C1-R0HEAT SINK 25MM X 25MM X 9.5MM夹，热介面材料方形，鳍片84 - 立即发货$95.73查看详情
HEAT SINK 29MM X 29MM X 19.5MMATS-53290R-C1-R0HEAT SINK 29MM X 29MM X 19.5MM夹，热介面材料方形，鳍片568 - 立即发货$109.81查看详情
HEAT SINK 17MM X 17MM X 9.5MMATS-53170D-C1-R0HEAT SINK 17MM X 17MM X 9.5MM夹，热介面材料方形，鳍片23 - 立即发货$94.67查看详情
HEAT SINK 25MM X 25MM X 14.5MMATS-53250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MM夹，热介面材料方形，鳍片225 - 立即发货$103.30查看详情
HEAT SINK 19MM X 19MM X 9.5MMATS-53190D-C1-R0HEAT SINK 19MM X 19MM X 9.5MM夹，热介面材料方形，鳍片114 - 立即发货$92.80查看详情
PTM Published on: 2011-10-13

Related Videos

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

发布日期：2012-10-15

Related Articles and Blogs

Thermal Conductivity: What is it and Why You Should Care A discussion on thermal conductivity, how to calculate it, and how to best remove heat energy from electrical components to prolong their lives.
Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiFLOW™ Heat Sinks maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area. Available in a wide variety of sizes and shapes.