TDK's CKC series capacitor arrays offer multiple multilayer ceramic chip capacitors (MLCCs) in a single package. TDK’s unique design offers low cross-talk to truly offer separate individual capacitors in a single package. Arrays come in 2-in-1 and 4-in-1 package styles. The 2-in-1 offers two individual capacitors of the same nominal value in a single package. Similarly, the 4-in-1 offers four individual capacitors of the same nominal value in a single package. Capacitor arrays reduce board space and component count. This also reduces placement time and warehouse/storage space. Common uses for capacitor arrays include noise decoupling - ideal considering today’s higher density circuits, increased feature designs, and smaller product sizes force designers to find ways to reduce component count simply due to the fact of no available board space. Capacitor arrays also allow placement of decoupling capacitors closer to high speed ICs/ASICs which reduces trace inductance.
| Features and Benefits |
|
|
- 2-in-1 or 4-in-1 package
- Reduced cross talk
- Allows decoupling closer to IC/ASIC, resulting in reduced trace inductance
- Reduces placement time by decreasing the total number of components on the design
|
|
- Decoupling around IC
- Mobile (handheld) multimedia products
- CPU bus line
- Bypass for digital signal line noise
- High density circuits where PCB real estate is a premium
|
设置
快速交货
免运费
国际贸易术语
支付类型
市场产品
TDK's CKC series capacitor arrays offer multiple multilayer ceramic chip capacitors (MLCCs) in a single package. TDK’s unique design offers low cross-talk to truly offer separate individual capacitors in a single package. Arrays come in 2-in-1 and 4-in-1 package styles. The 2-in-1 offers two individual capacitors of the same nominal value in a single package. Similarly, the 4-in-1 offers four individual capacitors of the same nominal value in a single package. Capacitor arrays reduce board space and component count. This also reduces placement time and warehouse/storage space. Common uses for capacitor arrays include noise decoupling - ideal considering today’s higher density circuits, increased feature designs, and smaller product sizes force designers to find ways to reduce component count simply due to the fact of no available board space. Capacitor arrays also allow placement of decoupling capacitors closer to high speed ICs/ASICs which reduces trace inductance.
