Tflex™ SF Product Portfolio Expansion

Laird non-silicone gap filler products now include Tflex SF4 and Tflex SF7. In addition to the Tflex SF10, these soft, non-silicone gap fillers offer superior thermal performance without overstressing boards and components. Featuring 4 W/mk, 7 W/mK, and 10 W/mk thermal conductivity, Laird has a material to fit all performance requirements.

The silicone-free technology provides products with excellent deflection properties and minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thicknesses from 0.5 mm (0.020”) up to 4 mm (0.160”) in 0.5 mm (0.020”) increments are available as standard.