Sil-Pad® 900S
适用于低压力应用的高性能绝缘子
Bergquist 推出真正的主力产品 Sil-Pad® 系列,Sil-Pad 900 绝缘材料专为要求高导热性能和电子隔离能力的各种应用而设计。 这些应用也通常具有低安装压力,以方便元件夹持。
特性
- 热阻:0.61°C-in2/W (@ 50 psi)
- 电气隔离
- 安装压力小
- 光滑且高度兼容的表面
- 通用热界面材料解决方案
应用
- 电源
- 汽车电子
- 电机控制
- 功率半导体器件
Sil-Pad 900-S
图片 | 制造商零件编号 | 描述 | 类型 | 形状 | 外形 | 可供货数量 | 查看详情 | |
---|---|---|---|---|---|---|---|---|
SP900S-0.009-00-54 | THERM PAD 19.05MMX12.7MM PINK | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 19424 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-104 | THERM PAD 25.4MMX19.05MM PINK | 垫,片材 | 矩形 | 25.40mm x 19.05mm | 14997 - 立即发货 | 查看详情 | ||
SP900S-0.009-AC-54 | THERM PAD 19.05MMX12.7MM W/ADH | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 8897 - 立即发货 | 查看详情 | ||
SP900S-0.009-AC-58 | THERM PAD 19.05MMX12.7MM W/ADH | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 3966 - 立即发货 | 查看详情 | ||
SP900S-0.009-AC-1212 | THERM PAD 304.8MMX304.8MM W/ADH | 垫,片材 | 方形 | 304.80mm x 304.80mm | 147 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-43 | THERM PAD 19.05MMX12.7MM PINK | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 1575 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-90 | THERM PAD 21.84MMX18.8MM PINK | 垫,片材 | 矩形 | 21.84mm x 18.80mm | 5505 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-114 | THERM PAD 24MMX21.01MM PINK | 垫,片材 | 矩形 | 24.00mm x 21.01mm | 743 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-05 | THERM PAD 41.91X28.96MM PINK | 垫,片材 | 菱形 | 41.91mm x 28.96mm | 852 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-105 | THERM PAD 36.83X21.29MM PINK | 垫,片材 | 矩形 | 36.83mm x 21.29mm | 1404 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-58 | THERM PAD 19.05MMX12.7MM PINK | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 0 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-02 | THERM PAD 45.21X31.75MM PINK | 垫,片材 | 菱形 | 45.21mm x 31.75mm | 0 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-25 | THERM PAD 25.4MMX6.6MM PINK | 垫,片材 | 圆形 | 25.40mm x 6.60mm | 0 - 立即发货 | 查看详情 | ||
SP900S-0.009-AC-05 | THERM PAD 41.91X28.96MM W/ADH | 垫,片材 | 菱形 | 41.91mm x 28.96mm | 0 - 立即发货 | 查看详情 | ||
SP900S-0.009-00-12 | THERM PAD 6.35MM DIA PINK | 垫,片材 | 圆形 | 6.35mm 直径 | 0 - 立即发货 | 查看详情 | ||
SP900S-0.009-AC-62 | THERM PAD 19.05MMX12.7MM W/ADH | 垫,片材 | 矩形 | 19.05mm x 12.70mm | 0 - 立即发货 | 查看详情 |
发布日期: 2013-10-07